“Designing and deploying secure devices remains a significant challenge for developers,” said Ian Harris, vice president of Microchip’s computing products group. “Implementing security with DICE gives designers confidence that the fundamental security of their device is based on principles that were developed and reviewed by industry experts. Combined with the DICE architecture, the full-featured CEC1702 provides an easy way to add the crucial security and privacy features required by embedded systems.”
Time and ease of use are top considerations for designers developing cloud-connected solutions. The CEC1702 IoT development kit with the DICE architecture helps designers speed up development cycles. The kit comes with a powerful, programmable 32-bit ARM® Cortex®-M4 microcontroller and sample code to quickly develop a secure, cloud-connected solution. Certified by Microsoft Azure, customers can develop their product with the confidence that the necessary components to connect to the internet have been vetted and certified.
“As the IoT landscape continues to increase with security threats, customers can turn to Microchip’s IoT development kit to quickly and easily connect devices to the cloud and incorporate DICE security standards in their product,” said Sam George, director, Microsoft Azure IoT at Microsoft Corp. “The development kit enables customers to implement the DICE standard into a device’s hardware while also benefitting from Microsoft Azure’s security and privacy features.”
Microchip simplifies adding authentication and encryption to connected devices with the CEC1702 IoT development kit. Key features of the kit include:
- CEC1x02 development board with a Plug-in Module (PIM) that contains the CEC1702 with integrated cryptography accelerators, saving code space and decreasing time to market
- Two headers compatible with MikroElektronika’s extensive library of click boards™, allowing for flexible design requirements
- MikroElektronika Wi-Fi® 7 click board, equipped with Microchip’s ATWINC1510-MR210PB IEEE 802.11 b/g/n module, optimized for low-power IoT applications
- MikroElektronika THERMO 5 click board, which can measure temperatures across four channels with ranges from 0 to 127 degrees Celsius and extended range of -64 to 191 degrees Celsius
Pricing and Availability
The CEC1702Q-B2-I/SX is available in production volume for $3.14 each in 5,000-unit quantities. The CEC1702 IoT development kit (DM990013-BNDL) is available for $199.99.
For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s website. To purchase products mentioned in this press release, go to Microchip’s full-service channel microchipDIRECT or contact one of Microchip’s authorized distribution partners.