Simulation of Smart Connected Products Featured in ANSYS Advantage

How connected are you to the amazing new technology surrounding you? With all the smart connected products that are being developed and deployed today, we can all be connected to our environment as never before. If you are the owner of smart home technology, you may be enjoying the benefits of voice-activated lighting, security and robotic vacuuming. Perhaps you own an Amazon Echo or a Google Home device that makes your life easier and more fun by answering questions you call out in any room of the house, or plays the music you want to hear at your command — no typing required! Maybe you have a personal health monitoring device that you wear on your wrist to count the number of steps you take or measure your hours of sleep and/or heart rate — all of which can be uploaded to a computer to keep track of your health goals.

ANSYS Advantage smart connectde products

If you work in industry, chances are that digital twins — virtual copies of physical equipment — will make your work life easier in the near future. A digital twin is the ultimate in smart connected products. It collects data from numerous sensors on the physical asset — temperature, flow rate, rotation speed, electromagnetic properties, etc. — and uses this data in the virtual model to monitor performance. It then uses the transmitted data as inputs for running simulations that can predict the future operations of the asset. A digital twin of a power generating turbine, for example, would combine an engineering model of the turbine running on a computer, with sensors feeding real-time data to the model and engineering simulation tools that use the data to predict potential problems before they happen. With the predictive power of digital twins, you can plan for repairs during the next scheduled downtime instead of during a costlier emergency shutdown.

Simulation is being leveraged by engineers across all these disciplines and more to improve the functionality of current smart connected products and invent new ones we have not even imagined yet. The latest issue of ANSYS Advantage reveals how engineering simulation is critical to developing successful connected products.

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Peraso Technologies engineers are putting more computer functionality into ever-smaller and lighter packages, like a tiny chipset for a USB stick that uses a SuperSpeed USB 3.0 port to achieve high wireless processing speeds. But cramming so many integrated circuits in so tight a space generates more heat. Learn how ANSYS multiphysics simulations helped Peraso Technologies to manage thermal challenges while reducing the thermal design cycle time by two-thirds.

28ghz antennaWireless connectivity depends on antennas to transmit and receive data and control signals to and from smart connected products, but 4G antennas are rapidly running out of bandwidth. Pivotal Commware is using ANSYS HFSS to develop 5G beamforming antennas that solve this problem by subdividing signals across the space domain. Read more about simulation of this technology.

ANSYS Icepak simulationCell phones are undoubtedly the most common devices that enable us to stay connected. Qualcomm engineers are performing thermal management to extend battery life and decelerate the deterioration of components. Discover how Qualcomm engineers have devised a unique dynamic power management strategy to keep your cell phone components below a specified temperature.

ANSYS Advantage smart connected productsThis is just a small sample of the contents of this issue of ANSYS Advantage. We hope you’ll read all the articles to learn how engineers are using simulation to solve their greatest smart connected product challenges in terms of size, weight, power and cooling; sensing and connectivity; product durability; reliability and safety; and systems integration.